简要说明：toyo牌的TOYO USP-1515M4，新友维直接代理东洋uv膜，半导体切产品：估价：电询，规格：0.165*300mm*100m，产品系列编号：齐全

　　

晶圆切割胶带 - Pressure Sensitive Series - Part Number : F - 90 T - 80 T - 120 GE - 200 A dicing tape is used for fixing workpiece during the dicing process in semiconductor, optical and electrical devices manufacturing.  High technology is required to a dicing tape with the developments of diversified chips with high quality, in accordance with requirements of each type of workpiece.  Elegrip dicing tapes produced by DENKA can correspond with anti-static requirement.  Elegrip dicing tapes are supplied to you not only in roll but also in roll with pre-cut, sheet and other form.  We Toyo Adtec consider needs of each user and choose appropriate tapes. Feature ● Various product line ● standard type (AD series) ● high-performance to difficult-to-adhere workpiece (ＧＤ series) ● excellent stability against elapsed deterioration (Ｔ series) ● high-performance to laser-dicing (F-90) ● Easy pick-up with excellent expandability Specification Recommended Works Part Number Base Film Color Thickness (μm) Adhesion Thickness (μm) Adhesive Strength (N/20mm) Probe Tack (N/20mm2) Feature Si GaAs Other Semiconductor F-90MW PO MW 90 10 1 1 PVC-free type T-80MW PVC 80 0.8 0.7 Excellent temporal stability T-80HW 1.7 1 T-120HW 120 1.7 1 Thick Workpiece 20GE-200 LB 200 2.7 2.9 For thick workpiece ＊The above data is just for representing value, and not guaranteed value. ＊Static type is lined up. ＊Color : MW (Milky White) ,LB (Light Blue), T (Transparent) ＊Separator thickness is not included.

晶圆切割胶带 - UV Series - Part Number : UDV - 80J / UDV - 100J / UHP - 110B UHP - 0805MC / UHP - 1005M3 UHP - 110M3 / UHP - 1025M3 UHP - 1510M3 / UHP - 1525M3 USP - 1515M4 / USP - 1515MG UDT - 1025MC / UDT - 1325D UDT - 1915MC A dicing tape is used for fixing workpiece during the dicing process in semiconductor, optical and electrical devices manufacturing.  High technology is required to a dicing tape with the developments of diversified chips with high quality, in accordance with requirements of each type of workpiece.  Elegrip dicing tapes produced by DENKA are widely used for dicing and singulation of driver ICs, LTCC substrates, EMC package substrates, Si wafers, ceramics, glass, lenses and so on.  Especially UV series of Elegrip dicing tapes enable strong holding power and easy peeling without glue residue, by deactivating adhesion with UV irradiation.  Elegrip dicing tapes can correspond with anti-static requirement.  Elegrip dicing tapes are supplied to you not only in roll but also in roll with pre-cut, sheet and other form.  We Toyo Adtec consider needs of each user and choose appropriate tapes. Feature ● Excellent control to back-side chipping and chip fly-off. ● Excellent adhesiveness. ● Smooth peeling by UV. ● High performance to EMC (Epoxy Mold Compound) and other types of difficult-to-adhere workpiece.

Recommended Work I Si GaAs Other Semi conductor Part Number UDV- 80J UDV- 100J UHP- 110B UHP- 0805MC UHP- 1005M3 UHP- 110M3 基材 PVC PO 颜色 T MW 总厚度 (μm) 80 100 110 85 105 110 黏着力 (μm) 10 5 10 Adhesive Strength (N/20mm) 3.8(0.2) 3.8(0.2) 2.9(0.2) 5.0(0.2) 5.0(0.2) 7.6(0.2) Probe Tack (N/20mm2) 2.1(0.05) 2.1(0.05) 2.7(0.05) 1.7(0.05) 2.7(0.05) 3.9(0.05) 特性 Easy pickup For less chipping For small size chips Recommended Work II Package Part Number UHP-1025M3 UHP-1510M3 UHP-1525M3 USP-1515M4 USP-1515MG 基材 PO 颜色 MW 总厚度 (μm) 125 160 175 165 黏着力 (μm) 25 10 25 15 Adhesive Strength (N/20mm) 12.0(0.2) 6.5(0.2) 13.5(0.2) 14.5(0.2) 15.0(0.2) Probe Tack (N/20mm2) 5.5(0.05) 4.2(0.05) 5.6(0.05) 6.2(0.05) 5.9(0.05) 特性 For encapsulated workpiece For less backside burrs For less glue scratch-up on the chip side walls For less against residue onto a making area Recommended Work III Glass Crystal Part Number UDT-1025MC UDT-1325D UDT-1915MC 基材 PET 颜色 T 总厚度 (μm) 125 155 203 黏着力 (μm) 25 15 Adhesive Strength (N/20mm) 30.0(0.2) 20.4(0.2) 20.3(0.2) Probe Tack (N/20mm2) 7.5(0.05) 6.7(0.05) 5.9(0.05) 特性 For less backside cracking For encapsulated workpiece For less backside cracking ＊( ) is adhesive strength after UV. ＊The above data is just for representing value, and not guaranteed value. ＊Static type is lined up. ＊Color : MW (Milky White), T (Transparent) ＊UV irradiate condition : Light volume=above 150mJ/cm2. ＊UV irradiate condition may change with dicing products. ＊Separator thickness is not included.